封装测试业作为半导体产业的传统领域，伴随着半导体技术的发展而推陈出新。如今，集成电路封装的目的不仅是节省空间和保护内部结构，还包括通过封装提高器件性能。未来，先进封装技术将主导集成电路封测市场，集成电路封装将朝着小型化、轻型化方向发展；随着集成电路设计复杂度的提高，先进封装面临的挑战也越来越多。
As a traditional field in the semiconductor industry，the packaging and testing industry has evolved with the development of semiconductor technology. Nowadays，the purpose of integrated circuit packaging is not only to save space and protect internal structures，but has begun to transform into the need for improving the performance of the device. Choosing the right package method to improve performance has become more and more challenging. In the future，advanced packaging technology will dominate the integrated circuit packaging and testing market development direction，and integrated circuit packaging will move toward miniaturization and lightness. However，with the increasing complexity of integrated circuit design，advanced packaging faces more and more challenges.
